PCB Components Dismantling Machine
The PCB Components Dismantling Machine removes electronic components from waste PCB boards using natural gas heating and a durable 6 mm #45 steel rotary drum. At 200–300 °C, solder melts and components detach through continuous rotation and scraping. Optional screening and magnetic separation units further classify materials, enabling efficient recovery of components, metals, and solder.
Details

The PCB Components Dismantling Machine is engineered for the industrial dismantling of electronic components from discarded PCB motherboards. It adopts natural gas as the heating source, offering energy efficiency and stable temperature control. Once the internal temperature reaches 200–300 °C, the solder on PCB pads softens, allowing components to fall off easily under the mechanical agitation inside the rotating drum.
Robust Drum Structure
The core dismantling drum is manufactured from 6 mm thick #45 high-strength steel and processed with a proprietary heat-resistant and wear-resistant surface treatment. This ensures:
- Long-term resistance to high temperatures
- Excellent abrasion durability under continuous operation
- Stable structural integrity and extended machine lifespan
- High dismantling precision and minimal PCB residue
- High-Efficiency Component Separation
As the drum rotates, PCB boards rub and collide with each other, enabling solder detachment and component separation. Detached components are discharged automatically. If customers require additional sorting steps, the machine can be paired with two auxiliary units:

1. Electronic Component Screening Machine
This unit screens dismantled components based on size, enabling clear grouping of similar-sized resistors, capacitors, ICs, connectors, and other parts.
2. Magnetic Separator
After size screening, magnetic separation is used to distinguish components containing ferrous materials. It effectively separates iron-containing parts (such as inductors, transformers, metal shells) from non-ferrous electronic components.

PROCESS DESCRIPTION
1. PCB dismantling machine body: Dismantle the electronic component from mother board, As for the tin, we also can recycle it;
2. Electronic component screen: Classify the similar size electronic components in one side;
3. Magnetic separator: Further classify these components which include iron or not.
Paramter
| Model | ZYCJ-200 | ZYCJ-300 | ZYCJ-500 |
|---|---|---|---|
| Capacity | 200 Kg/H | 300 Kg/H | 500 Kg/H |
| Power | 0.75+1.1+3 | 0.75+2.2+3 | 0.75+3+3 |
| Weight | 450 Kg | 700 Kg | 1100 Kg |
Features
Advanced Emission Control
The primary dismantling equipment is linked to a spraying system for
dust removal and cooling, while VOCS are processed using
photo-oxygen catalysis and activated carbon adsorption. The exhaust
gas treatment system features a variable-frequency speed governor
After treatment, clean air is discharged into the ventilation system via
the exhaust fan.



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